CUSTOM RFID & NFC INLAY MANUFACTURER
RFID & NFC Inlay Manufacturer
Custom UHF RFID, HF and NFC inlays engineered for smart labels, connected packaging, retail tracking and product identification.
CUSTOM RFID & NFC INLAY MANUFACTURER
Custom UHF RFID, HF and NFC inlays engineered for smart labels, connected packaging, retail tracking and product identification.
ENGINEERED FOR YOUR APPLICATION
Xiangmai manufactures dry and wet RFID/NFC inlays for integration into labels, tags and connected packaging. We support chip and antenna selection, inlay converting, encoding, performance verification and OEM production.
Each project is evaluated around read range, operating frequency, product material, size, converting format and downstream application requirements.
A controlled workflow from application review to verified production output.
01
Define frequency, chip, antenna and converting needs.
02
Prepare the selected antenna for the required application.
03
Align and bond the chip to the antenna connection points.
04
Convert the inlay into approved dry, wet or roll formats.
05
Verify data, function and performance before release.
PRECISION ASSEMBLY
Accurate chip placement and stable antenna connection are essential to reliable inlay performance. Our controlled assembly process focuses on alignment, bonding consistency and functional inspection.
Precise placement supports consistent electrical connection.
Process controls support stable bonding and repeatable output.
Bond points and functional response are inspected during production.
Chip selection is aligned with memory, security and read requirements.
Inlay construction is selected around frequency, read distance, available space and the surrounding product material.
RAIN RFID options for inventory, retail, logistics and supply chain visibility.
Short-range options for identification, authentication and digital interaction.
Chip-and-antenna assemblies prepared for downstream converting processes.
Adhesive inlays supplied in project-specific roll and converting formats.
Data and function are verified to support dependable integration into smart labels and connected packaging.
EPC, UID, URL or approved project data can be programmed as required.
Written data is checked against the approved data specification.
Inlays are checked for communication and application-relevant performance.
Non-conforming units are identified before approved production is released.
Custom inlays engineered for identification, traceability and connected product experiences.
RFID/NFC foundations for printed labels and adhesive tags.
Inventory visibility, item identification and retail operations.
Tracking support for cartons, assets and supply chain workflows.
Digital product information and customer engagement through NFC.
Unique identification for brand protection and product verification.
Custom formats for equipment, components and controlled assets.
Real manufacturing resources supporting engineering, production, encoding and quality verification.
Controlled workflows from material preparation to verified output.
Application review, specification support and sample development.
Flexible project support from prototypes to repeat manufacturing.
Data, function and output are checked against approved requirements.
A dry inlay is the chip-and-antenna assembly without an adhesive label construction. A wet inlay adds an adhesive layer and is prepared for converting or direct integration according to the project.
UHF RFID is commonly selected for longer-range, multi-item inventory and logistics applications. HF/NFC is typically used for shorter-range identification, smartphone interaction and connected packaging.
Yes. Selection can be evaluated around frequency, memory, security, read range, available size, surrounding materials and the intended use environment.
Custom antenna and inlay options depend on project volume and technical feasibility. Roll direction, pitch, liner and converting requirements can be reviewed during development.
Yes. Project-specific data can be encoded and verified, while functional and performance checks are aligned with the approved product specification.
Yes. Share your target application, frequency, chip, size, quantity and converting requirements so our team can evaluate sampling and production options.
Share your frequency, chip, size, application, converting and quantity requirements with our RFID/NFC engineering team.